The X-Prep® milling/grinding/polishing system allows thinning of non-flat/warped silicon and other substrates with unmatched accuracy. Featuring a user-friendly interface through a 12" color touchscreen, operators of all skill levels can use the machine for a wide variety of applications. No special programming (like G-code) is necessary, as the user is led automatically through the setup routine and guided throughout the sample preparation procedure. This ensures repeatability and accuracy as the X-Prep® keeps track of all necessary steps.

The X-Prep® has been engineered with advanced components and technology to deliver sophisticated, unmatched results to give you exactly what you need in a sample preparation tool.