Date: November 17 - November 20, 2025

Location: Pasadena Convention Center -Pasadena, California

Booth: 501

As the premier event for the microelectronics failure analysis community, ISTFA brings together leading experts, industry professionals, and researchers to share insights, innovations, and methodologies in the field. This year’s theme, “Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging,” reflects the industry’s evolving landscape, where traditional scaling approaches are being challenged by the integration of diverse technologies and packaging strategies. Attendees will engage in a comprehensive program that includes keynote presentations, technical sessions, workshops, and networking opportunities, all designed to foster collaboration and knowledge exchange.

For a complimentary pass to attend the exhibition portion of the ISTFA Conference, please fill out the "contact us" form and a pass will be emailed to you.