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Lapping Films
Diamond Lapping Film consists of precision graded diamond
particles resin bonded to a flat, uniform polyester film backing.
It provides excellent edge retention and maintains coplanarity
regardless of varying materials or hardness within the
sample. Typically it is used for unencapsulated cross-
sectioning, TEM wedge/plan-view polishing, backside
polishing and pre-FIB sample thinning. Allied's unique
packaging allows for quick and easy identification of color-
coded micron grades.
Excellent For:
- IC Cross-sectioning
- TEM/Pre-FIB Thinning
- Unencapsulated sample polishing
- Fiber optic polishing (4 inch and 5 inch also available)
| Type B Discs (Pk/5) |
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Diamond Lapping Film Type B has diamond particles
contained in ceramic beads which are then resin bonded to
the film. As the beads wear away, new diamond particles are
exposed to allow continuous, aggressive material removal.
Type B Film is longer lasting and provides a coarser finish
grade-for-grade compared with regular diamond lapping film.
Not recommended for polishing IC's.
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| 8" Aluminum Oxide Discs (Pk/50) |
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| 8" Silicon Carbide Discs (Pk/50) |
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| All contents copyright © 2004 Allied High Tech Products, Inc. All rights reserved. All product names are trademarks or registered trade marks of their respective holders. Terms of Use. |
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