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Colloidal Silica / Alumina Suspensions
Used for final polishing, colloidal suspensions are mixtures
of abrasive particles dispersed throughout a chemically
aggressive liquid carrier. This combination provides a
chemical-mechanical polishing action, resulting in
deformation-free surfaces.
| 0.05µm Blue Colloidal Silica |
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A non-crystallizing silica suspension with a pH of 9.8.
Excellent for IC cross-sectioning or polishing soft and
ductile materials such as titanium, copper, aluminum and
solder.
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| 0.02µm Blue Colloidal Silica |
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A non-crystallizing silica suspension with a pH of 10.5.
Used to provide ultra fine surface finishes for SEM/TEM
analysis.
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| 0.06µm White Colloidal Silica |
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A more aggressive silica suspension with a pH of 8.5.
Used to achieve faster, more defined grain boundaries on
metals and rapid material removal when delayering IC's.
Crystallizes if not flushed with water immediately after
polishing.
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| 0.05µm & 0.03µm Colloidal Aluminas |
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An acidic alumina suspension with a pH of 3.5. Used to
final polish alloy steels, nickel based alloys and ceramics.
Non-clogging formula flows easily through fluid dispensing
systems.
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| 0.04µm Purple Colloidal Silica |
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A non-stick, rinsable colloidal silica suspension with a pH of 10.47. Excellent for final polishing of all materials with the added benefit of being easy to clean from samples, polishing cloths and machines. Product does not harden and clog the dispenser or drop particles onto cloths when dispensing. Purple color aids in identifying/differentiating from other colloidal products.
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| 0.05µm Colloidal Silica/Alumina |
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A unique mixture of colloidal silica and alumina with a pH of 8.5. The addition of gamma alumina allows improved mechanical polishing when compared to colloidal silica. Used to final polish both ferrous and non-ferrous metals, metal-matrix composites and various non-metallic materials.
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