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Colloidal Silica / Alumina Suspensions
Used for final polishing, colloidal suspensions are mixtures
of abrasive particles dispersed throughout a chemically
aggressive liquid carrier. This combination provides a
chemical-mechanical polishing action, resulting in
deformation-free surfaces.
| 0.05µm Blue Colloidal Silica |
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A non-crystallizing silica suspension with a pH of 9.8.
Excellent for IC cross-sectioning or polishing soft and
ductile materials such as titanium, copper, aluminum and
solder.
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| 0.02µm Blue Colloidal Silica |
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A non-crystallizing silica suspension with a pH of 10.5.
Used to provide ultra fine surface finishes for SEM/TEM
analysis.
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| 0.06µm White Colloidal Silica |
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A more aggressive silica suspension with a pH of 8.5.
Used to achieve faster, more defined grain boundaries on
metals and rapid material removal when delayering IC's.
Crystallizes if not flushed with water immediately after
polishing.
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| 0.05µm & 0.03µm Colloidal Aluminas |
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An acidic alumina suspension with a pH of 3.5. Used to
final polish alloy steels, nickel based alloys and ceramics.
Non-clogging formula flows easily through fluid dispensing
systems.
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| 0.05µm Colloidal Silica/Alumina |
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A unique mixture of colloidal silica and alumina with a pH of 8.5. The addition of gamma alumina allows improved mechanical polishing when compared to colloidal silica. Used to final polish both ferrous and non-ferrous metals, metal-matrix composites and various non-metallic materials.
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