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Cold Mounting
Cold mounting materials are used to encapsulate samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of the mounting material is needed or when a large quantity of samples must be encapsulated at once.
Acrylics: Typically chosen for their rapid cure times, acrylics are used when large volume sample throughput is needed.
Epoxies: Typically chosen for their excellent flow and penetration, epoxies are used when better adhesion, less shrinkage and clarity are required.
| QuickCure Acrylic |
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Offers good clarity, flow, bonding and grinding
characteristics, for a wide variety of materials.
Features:
- Cure time: 15-20 minutes
- 82 Shore D hardness
- Excellent clarity
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| QuickSet Acrylic |
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QuickSet is used to encapsulate a wide variety of metallographic specimens, especially printed circuit boards and other electronic components.
Features:
- Cure time: 6-8 minutes
- 84 Shore D hardness
- Excellent hole penetration on PCB's
- Low shrinkage improves adhesion
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| EpoxyMount |
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A fast-curing epoxy that hardens in 2 hours at room
temperature while still maintaining quality characteristics
such as good adhesion, hardness and minimal shrinkage.
Features:
- Cure time: 2 hours, room temperature (1¼" diameter x 1" thick)
- Heat (38ºC/100°F) accelerates cure time to 45 minutes
- 87 Shore D hardness
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| EpoxySet |
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A very low viscosity epoxy offering excellent flow and
penetration. It is extremely hard, crystal clear, and exhibits
firm adhesion with virtually no shrinkage. Low curing
temperature is ideal for heat sensitive samples.
Features:
- Cure time: 8 hours, room temperature
- 89 Shore D hardness
- Excellent adhesion, with virtually no shrinkage
- Low viscosity allows for penetration into small crevices / holes
- Peak curing temperature: 54ºC/130°F
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