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The Cross-Sectioning Tool is used to cross-section small, unencapsulated samples such as IC's and other electronic devices. The unencapsulated technique has several advantages compared with encapsulation: it is much cleaner, faster, and eliminates the use of mounting and polishing materials such as epoxies, acrylics, suspensions and compounds. Because only the sample itself is polished, diamond lapping film can be used, taking advantage of its many benefits. (See Diamond Lapping Film.)

Hand-held throughout the entire polishing process, the tool's unique design is stable, well-balanced and has a low center of gravity to avoid rocking during polishing. Adjustable Teflon™ feet allow angle alignment of the polishing plane. The cross-sectioning paddle is attached using a cam-locking system (no tools needed), allowing quick, easy paddle removal for sample inspection and exact repositioning throughout the polishing procedure.

Features:

• Lightweight anodized aluminum body for corrosion resistance
• Adjustable Teflon™ Feet for polishing plane alignment
• Cam-locking system eliminates the need for tools
• Cam-lock Lever can be mounted on the right or left side according to operator's preference
• Low profile paddle fits under objectives in most microscopes
• Small, compact, easy to handle
• Aluminum Cross-Sectioning Paddle fits into most SEMs without the need to demount the sample

Closer View