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The MultiPrep™ System enables precise semi-automatic sample preparation of a wide range of materials for microscopic (optical, SEM, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, precise angle polishing, site-specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill. The MultiPrep eliminates the need for hand-held polishing jigs, and ensures that only the sample makes contact with the abrasive. It maintains geometric orientation of the sample relative to the abrasive plane during polishing, allowing quantification of material removal; rate of polish can be monitored, and total amount removed can be preset.

The polishing machine provides the power supply necessary to operate the MultiPrep™ positioning device, and features a control panel used to activate the MultiPrep's functions. Platen rotation speeds range from 5 to 350 RPM, in either clockwise or counterclockwise direction. Touch-pad switches control all functions, with a numerical keypad to program platen speed, timer, oscillation and rotation settings. The system uses water as the standard coolant; however, the AD-5™ Fluid Dispenser is available to apply abrasive suspensions and/or lubricants.

Features:

• Front Digital Dial Indicator displays real-time material removal/sample advancement, 1 micron resolution
• Precision spindle design indexes the sample perpendicular to the platen, and can rotate simultaneously
• Dual axis, micrometer-controlled angular positioning of the sample (pitch and roll), +10/-2.5° range, 0.02° increments
• Rear Digital Indicator displays vertical positioning (static) with zeroing function, 1 micron resolution
• Automatic sample oscillation, adjustable sweep with 6 speeds
• Full or limited automatic sample rotation with 8 speeds
• Variable platen speed: 5-350 RPM, in 5 RPM increments
• Touch-pad switches controll all functions
• ¼ HP (190 W) DC motor with durable reduction gearbox provides constant high-torque output
• Digital Timer and Tachometer
• Clockwise/counterclockwise platen rotation
• Bowl flush to prevent debris buildup
• Electronic coolant control with adjustable valve
• Gear-driven spindle for applications demanding higher rotational torque, i.e., larger or encapsulated samples
• Cam-locking system eliminates the need for tools and allows for exact repositioning of fixtures
• CE Compliant
• Two (2) year warranty - parts and labor
• Designed & manufactured in the USA

The MultiPrep^™ System provides Unequalled Results in a variety of sample preparation applications. To learn more, view the Acrobat PDF file below.

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Holds flat, unencapsulated samples perpendicular to the platen and has a reference edge to allow for better alignment. They have a removable pin and female port allowing easy adaptation to an SEM chamber and are made of aluminum. Samples are typically secured using hot mounting wax.

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Holds either the #15-1010 Cross-Sectioning Paddle or the #15-1013 TEM Wedge/FIB Thinning Paddle. It extends the paddle/sample from under the hub assembly for easy viewing and handling.

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Holds flat, unencapsulated samples perpendicular to the platen. They have a removable pin and female port allowing easy adaptation to an SEM chamber and are made of aluminum. Samples are typically secured using hot mounting wax.

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Used for second side TEM wedge polishing and single specimen FIB thinning of IC’s and other small samples. The Pyrex stub (5.3mmW x 3.5mmD x 12mmH) is permanently bonded to the aluminum body and allows light to easily pass through for optical examination.

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Used for wedge/plan-view TEM polishing, multiple sample FIB thinning and precision parallel semiconductor thinning for SIMS analysis. Includes removable #69-40015 Pyrex inserts (½" diameter, Pk/4) which allow light through for optical examination.

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Used for parallel delayering and backside polishing of IC’s and other electronic devices. They are made of stainless steel and precision lapped, parallel to within 2 microns. Samples are secured using wax or double-sided tape. The numbered grid aids with sample orientation.

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Used to secure encapsulated mounts up to 1½" diameter. Three screws secure the sample.

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Used for applications where the sample size requires more load than the spindle can provide (approximately 600 grams). Includes (2) barrel weights and (3) slotted weights totaling 650 grams. Note: Dial Indicator must be removed when using barrel weights.

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Used to hold larger, flat encapsulated or unencapsulated samples perpendicular to the platen. Samples are typically secured in the fixture, sectioned close to the area of interest on the TechCut™ Precision Sectioning Machine, then attached to the MultiPrep™ for polishing, assuring that the desired polishing plane is maintained throughout the preparation procedure.

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Used in the same manner as #15-1045, except it orients the sample at a 45° angle. Typically used for precision cross-sectioning of electronic packages. Teflon screws provide gentle but firm pressure on delicate samples.

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The Dial Indicator Measurement System is used to verify sample thickness or removal of material. Typical applications include thinning of silicon for emission microscopy or SIMs analysis, plan-view TEM preparation, and TEM/FIB Thinning. The remote cable allows lifting of the spindle without altering dial position. The dial indicator displays both metric and standard in 1 micron/0.00005" increments.