The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. The 12" MultiPrep™ System has a scaled positioning device and higher torque rotation/oscillation motors for preparation of larger or multiple samples exceeding an area of 1,600 mm².
Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.